Disclosed is a method of peeling a protective member from a wafer, the protective member composed of a resin and a film, the film attached to one side of the wafer through the resin in a state in which a protruding portion is formed. The method includes: a step of holding the other side of the wafer, with the protective member on the lower side; an outer circumferential edge adhered resin peeling step of grasping the protruding portion of the protective member, and pulling the protruding portion to an outer side than an outer circumferential edge of the wafer, to peel the resin adhered to the outer circumferential edge of the wafer from the outer circumferential edge of the wafer; and a step of peeling, after the outer circumferential edge adhered resin peeling step, the whole body of the protective member from the wafer.