Invention Grant
- Patent Title: Substrate supporting apparatus
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Application No.: US14647729Application Date: 2012-11-27
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Publication No.: US10410906B2Publication Date: 2019-09-10
- Inventor: Hui Wang , Fuping Chen , Huaidong Zhang , Wenjun Wang
- Applicant: ACM Research (Shanghai) Inc.
- Applicant Address: CN Shanghai
- Assignee: ACM Research (Shanghai) Inc.
- Current Assignee: ACM Research (Shanghai) Inc.
- Current Assignee Address: CN Shanghai
- Agency: Osha Liang LLP
- International Application: PCT/CN2012/085319 WO 20121127
- International Announcement: WO2014/082196 WO 20140605
- Main IPC: H01L21/687
- IPC: H01L21/687 ; B23B31/30 ; H01L21/683 ; H01L21/67

Abstract:
A substrate supporting apparatus includes a rotatable chuck, a first mass flow controller, a second mass flow controller, a plurality of locating pins and guiding pillars, and a motor in which the rotatable chuck defines a plurality of first injecting ports and second injecting ports, the first injecting ports are connected with a first gas passage for supplying gas to the substrate and sucking the substrate by Bernoulli effect, the second injecting ports are connected with a second gas passage for supplying gas to the substrate and lifting the substrate, the first and the second mass flow controllers are respectively installed on the first and the second gas passages, the plurality of locating pins and guiding pillars are disposed at the top surface of the rotatable chuck and every guiding pillar protrudes to form a holding portion, and the motor is used for rotating the rotatable chuck.
Public/Granted literature
- US20150325466A1 SUBSTRATE SUPPORTING APPARATUS Public/Granted day:2015-11-12
Information query
IPC分类: