Invention Grant
- Patent Title: Fabricating contacts of a CMOS structure
-
Application No.: US15885945Application Date: 2018-02-01
-
Publication No.: US10410926B2Publication Date: 2019-09-10
- Inventor: Lukas Czornomaz , Veeresh V. Deshpande , Vladimir Djara , Pouya Hashemi
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Daniel Morris
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/417 ; H01L21/8234 ; H01L21/84 ; H01L21/306 ; H01L21/3065

Abstract:
The invention relates to a method comprising providing a substrate with a channel layer, forming a gate stack structure on the channel layer and forming a raised source and a raised drain on the channel layer. The method further comprises depositing in a non-conformal way an oxide layer above the gate stack structure, the raised source and the raised drain. A first void above the raised source and a second void above the raised drain gate are created adjacent to vertical edges of the gate stack structure. The method further comprises etching the oxide layer for a predefined etching time, thereby removing the oxide layer above the raised source and the raised drain, while keeping it at least partly on the channel layer. Contacts are formed to the raised source and the raised drain. The invention also concerns a corresponding computer program product.
Public/Granted literature
- US20180294193A1 FABRICATING CONTACTS OF A CMOS STRUCTURE Public/Granted day:2018-10-11
Information query
IPC分类: