- Patent Title: Semiconductor packages relating to thermal redistribution patterns
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Application No.: US16036242Application Date: 2018-07-16
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Publication No.: US10410947B2Publication Date: 2019-09-10
- Inventor: Dae Woong Lee
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2017-0152636 20171115
- Main IPC: H01L23/367
- IPC: H01L23/367 ; H01L25/18 ; H01L23/373 ; H01L23/00
Abstract:
A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.
Public/Granted literature
- US20190148257A1 SEMICONDUCTOR PACKAGES RELATING TO THERMAL REDISTRIBUTION PATTERNS Public/Granted day:2019-05-16
Information query
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