Invention Grant
- Patent Title: Cooling module, water-cooled cooling module and cooling system
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Application No.: US14735559Application Date: 2015-06-10
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Publication No.: US10410954B2Publication Date: 2019-09-10
- Inventor: Chien-Hung Sun , Lei-Lei Liu
- Applicant: COOLER MASTER CO., LTD.
- Applicant Address: TW New Taipei
- Assignee: COOLER MASTER CO., LTD.
- Current Assignee: COOLER MASTER CO., LTD.
- Current Assignee Address: TW New Taipei
- Agency: Maschoff Brennan
- Priority: TW104206825U 20150505
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/46 ; F28D15/02 ; H01L23/473 ; H05K7/20 ; F28D21/00

Abstract:
A cooling module used in conjunction with a heating element includes a vapor chamber and a plurality of cooling fins. The vapor chamber is in contact with one side of the heating element. The vapor chamber is disposed with a direct conduction area and a vacuum block disposed on two sides of the direct conduction area respectively. Each vacuum block forms a chamber. The cooling fins protrude from and are vertically disposed on the direct conduction area and each vacuum block, respectively. Thereby, the effects of fast vertical heat transfer to the fin and fast horizontal heat transfer to the distal cooling fins are achieved.
Public/Granted literature
- US20160330868A1 COOLING MODULE, WATER-COOLED COOLING MODULE AND COOLING SYSTEM Public/Granted day:2016-11-10
Information query
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