Invention Grant
- Patent Title: Semiconductor device and method of manufacturing thereof
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Application No.: US16053310Application Date: 2018-08-02
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Publication No.: US10410973B2Publication Date: 2019-09-10
- Inventor: Yi Seul Han , Tae Yong Lee , Ji Yeon Ryu
- Applicant: Amkor Technology, Inc.
- Applicant Address: US AZ Tempe
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Tempe
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/00 ; H01L23/31 ; H01L23/16 ; H01L21/56 ; H01L23/538
Abstract:
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising one or more conductive shielding members and an EMI shielding layer, and a method of manufacturing thereof.
Public/Granted literature
- US20180342465A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF Public/Granted day:2018-11-29
Information query
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