Invention Grant
- Patent Title: Semiconductor chip
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Application No.: US15841379Application Date: 2017-12-14
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Publication No.: US10410980B2Publication Date: 2019-09-10
- Inventor: Thomas Kuenemund , Mayk Roehrich
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Viering, Jentschura & Partner MBB
- Priority: DE102016124590 20161216
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L27/02 ; H01L27/092 ; G06F21/72 ; H01L21/8238 ; G06F21/00 ; H01L27/118

Abstract:
According to one embodiment, a semiconductor chip is described including a semiconductor chip body and a semiconductor chip circuit on the body and including a first circuit path coupled to a first and a second node and including at least two gate-insulator-semiconductor structures and a second circuit path coupled to the first and the second node and including at least two gate-insulator-semiconductor structures. The first and the second circuit path are connected to set the first and the second node to complementary logic states. In each of the first and the second circuit path, at least one of the gate-insulator-semiconductor structures is configured as field effect transistor. In at least one of the first and the second circuit path, at least one of the gate-insulator-semiconductor structures is configured to connect the circuit path to the semiconductor body.
Public/Granted literature
- US20180174985A1 SEMICONDUCTOR CHIP Public/Granted day:2018-06-21
Information query
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