Invention Grant
- Patent Title: Effective medium semiconductor cavities for RF applications
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Application No.: US14985839Application Date: 2015-12-31
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Publication No.: US10410981B2Publication Date: 2019-09-10
- Inventor: Bucknell C. Webb
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Daniel P. Morris
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01Q1/22 ; H01Q1/38 ; H01Q1/40 ; H01Q9/06
Abstract:
An electronic package apparatus is formed from a semiconductor substrate having a cavity formed therein. The cavity has a top surface, a bottom surface and a sidewall surface, and a spacer extending from the bottom surface to the top surface. The spacer is formed from a dielectric material and has at least one lateral dimension less than 0.1 cm.
Public/Granted literature
- US20170194270A1 EFFECTIVE MEDIUM SEMICONDUCTOR CAVITIES FOR RF APPLICATIONS Public/Granted day:2017-07-06
Information query
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