Invention Grant
- Patent Title: Ball forming device, wire-bonding apparatus, and ball formation method
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Application No.: US15235125Application Date: 2016-08-12
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Publication No.: US10410992B2Publication Date: 2019-09-10
- Inventor: Yoshihito Hagiwara , Kazumasa Sasakura , Tatsuyuki Sunada
- Applicant: SHINKAWA LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINKAWA LTD.
- Current Assignee: SHINKAWA LTD.
- Current Assignee Address: JP Tokyo
- Agency: JCIPRNET
- Priority: JP2014-025487 20140213
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B23K20/00 ; B23K9/00 ; B23K101/42

Abstract:
A ball forming device 50 for forming a ball 43 at a tip of a wire 42 by producing discharge between a torch electrode 48 and the tip of the wire 42, the device includes: a current supply unit 54 configured to supply a ball-forming current between the torch electrode 48 and the tip of the wire 42; and a current control unit 57 configured to control the current supply unit 54, so that a signal of the ball-forming current for a predetermined period includes a first period in which the signal takes a predetermined current value and a second period including a triangle wave. With this, it is possible to provide a ball forming device, a wire-bonding apparatus, and a ball formation method that are capable of suppressing formation of deformed balls.
Public/Granted literature
- US20160351538A1 BALL FORMING DEVICE, WIRE-BONDING APPARATUS, AND BALL FORMATION METHOD Public/Granted day:2016-12-01
Information query
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