Invention Grant
- Patent Title: SRAM memory cell and SRAM memory with conductive interconnect
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Application No.: US15153318Application Date: 2016-05-12
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Publication No.: US10411018B2Publication Date: 2019-09-10
- Inventor: Tzu-Yin Chiu , Juilin Lu , Jianxiang Cai
- Applicant: Semiconductor Manufacturing International Corp.
- Applicant Address: CN Shanghai
- Assignee: Semiconductor Manufacturing International Corp.
- Current Assignee: Semiconductor Manufacturing International Corp.
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201210393117 20121016
- Main IPC: H01L27/11
- IPC: H01L27/11 ; H01L27/092 ; H01L23/528 ; H01L27/088 ; H01L27/02 ; H01L23/532 ; H01L21/8234

Abstract:
Various embodiments provide semiconductor structures and their fabrication methods. An SRAM memory cell can include at least one semiconductor structure, and an SRAM memory can include at least one SRAM memory cell. An exemplary semiconductor structure can include at least two adjacent transistors formed on a semiconductor substrate. An opening can be formed and surrounded by gates of the two adjacent transistors and a doped region formed between the gates of the two adjacent transistors. A conductive layer can be formed to at least partially cover a bottom and a sidewall of the opening to electrically connect a gate of one transistor with the doped region of the other transistor of the two adjacent transistors.
Public/Granted literature
- US20160260720A1 SRAM MEMORY CELL AND SRAM MEMORY Public/Granted day:2016-09-08
Information query
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