Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US15755098Application Date: 2015-12-28
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Publication No.: US10411093B2Publication Date: 2019-09-10
- Inventor: Katsumi Nakamura , Tatsuo Harada , Noritsugu Nomura
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2015/086557 WO 20151228
- International Announcement: WO2017/115434 WO 20170706
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/78 ; H01L29/861 ; H01L29/868 ; H01L21/04 ; H01L21/225 ; H01L29/06 ; H01L29/739 ; H01L29/36 ; H01L29/66 ; H01L29/16 ; H01L29/20 ; H01L21/263

Abstract:
An active cell region, an edge termination region surrounding the active cell region and an intermediate region located at an intermediate position between these regions are provided, the active cell region has a trench gate type MOS structure on a top side, and a vertical structure on a bottom side includes a p-collector layer, an n-buffer layer on the p-collector layer, and an n-drift layer on the n-buffer layer, the n-buffer layer has a first buffer portion provided on the p-collector layer side, and a second buffer portion provided on the n-drift layer side, the peak impurity concentration of the first buffer portion is higher than the peak impurity concentration of the second buffer portion, and the impurity concentration gradient on the n-drift layer side of the second buffer portion is gentler than the impurity concentration gradient on the n-drift layer side of the first buffer portion.
Public/Granted literature
- US20180248003A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-08-30
Information query
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