Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
-
Application No.: US16019190Application Date: 2018-06-26
-
Publication No.: US10411105B2Publication Date: 2019-09-10
- Inventor: Akihiro Hikasa , Kazusuke Kato
- Applicant: ROHM CO., LTD. , LAPIS Semiconductor Co., Ltd.
- Applicant Address: JP Kyoto JP Kanagawa
- Assignee: ROHM CO., LTD.,LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: ROHM CO., LTD.,LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Kyoto JP Kanagawa
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2016-014560 20160128
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L29/45 ; H01L21/02 ; H01L21/04 ; H01L21/3205 ; H01L21/3213 ; H01L29/16 ; H01L29/732 ; H01L29/739 ; H01L29/78 ; H01L29/861 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/06 ; H01L23/532

Abstract:
A semiconductor device according to the present invention includes: a semiconductor layer including a first conductivity type semiconductor region and a second conductivity type semiconductor region joined to the first conductivity type semiconductor region; and a surface electrode connected to the second conductivity type region on one surface of the semiconductor layer, including a first Al-based electrode, a second Al-based electrode, an Al-based oxide film interposed between the first Al-based electrode and the second Al-based electrode, and a plated layer on the second Al-based electrode.
Public/Granted literature
- US20180315826A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-11-01
Information query
IPC分类: