- Patent Title: Air gap spacer with wrap-around etch stop layer under gate spacer
-
Application No.: US15851149Application Date: 2017-12-21
-
Publication No.: US10411114B2Publication Date: 2019-09-10
- Inventor: Chen Zhang , Kangguo Cheng , Xin Miao , Wenyu Xu , Peng Xu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L29/66 ; H01L29/49 ; H01L29/78 ; H01L29/417 ; H01L21/28 ; H01L21/02

Abstract:
Semiconductor devices and methods are provided to fabricate FET devices. For example, a semiconductor device can include a functional gate structure on a channel region of a fin structure; and a source/drain region on each side of the functional gate structure. The functional gate structure has an insulator material abutting a portion of the sidewalls of the functional gate structure and the source drain region and the top surface of the fin, with a top surface of the insulator material in contact with a bottom surface of the first spacer layer. The functional gate structure further includes a dielectric top layer. The dielectric top layer seals an air gap between the top surface of the insulator material and the dielectric top layer.
Public/Granted literature
- US20190198635A1 AIR GAP SPACER WITH WRAP-AROUND ETCH STOP LAYER UNDER GATE SPACER Public/Granted day:2019-06-27
Information query
IPC分类: