Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15901994Application Date: 2018-02-22
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Publication No.: US10411117B2Publication Date: 2019-09-10
- Inventor: Hiroaki Yamashita , Syotaro Ono , Hisao Ichijo
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronics Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronics Devices & Storage Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: White & Case LLP
- Priority: JP2017-197705 20171011
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/423 ; H01L29/10

Abstract:
A semiconductor device of an embodiment includes a semiconductor layer having a first plane and a second plane, a first semiconductor region of a first conductivity type, a second semiconductor region and a third semiconductor region of a second conductivity type, the first semiconductor region interposed between the third semiconductor region and the second semiconductor region, a first well region of a first conductivity type, a second well region of a first conductivity type separated from the first well region, a first contact region of a first conductivity type, a second contact region of a first conductivity type, a gate electrode provided on the first semiconductor region between the first well region and the second well region, a source electrode having a first region in contact with the first contact region and a second region in contact with the second contact region, and a drain electrode.
Public/Granted literature
- US20190109215A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-04-11
Information query
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