- Patent Title: Semiconductor memory device and method of manufacturing the same
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Application No.: US15362467Application Date: 2016-11-28
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Publication No.: US10411137B2Publication Date: 2019-09-10
- Inventor: Tomomitsu Risaki
- Applicant: SII Semiconductor Corporation
- Applicant Address: JP
- Assignee: ABLIC Inc.
- Current Assignee: ABLIC Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2014-018756 20140203
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L27/11521 ; H01L29/66 ; H01L29/423 ; H01L21/265 ; H01L27/11524 ; H01L29/06 ; H01L29/78

Abstract:
Provided is a semiconductor device, which prevents unnecessary voltage drop in a MOS transistor that is connected in series in a location between a booster circuit and a memory main body portion, to thereby operate on a low voltage and improve the ON/OFF ratio so that chip size shrinking and memory performance improvement are accomplished simultaneously. In a semiconductor memory device including a memory transistor portion and a select transistor portion, at least the select transistor portion is formed of a fin-shaped single-crystal semiconductor thin film.
Public/Granted literature
- US20170077309A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-03-16
Information query
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