- Patent Title: Flash memory structure, memory array and fabrication method thereof
-
Application No.: US15783721Application Date: 2017-10-13
-
Publication No.: US10411138B2Publication Date: 2019-09-10
- Inventor: Binghan Li
- Applicant: Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- Applicant Address: CN Shanghai
- Assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- Current Assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corporation
- Current Assignee Address: CN Shanghai
- Agency: Murtha Cullina LLP
- Priority: CN201710241903 20170414
- Main IPC: H01L29/788
- IPC: H01L29/788 ; H01L29/78 ; H01L27/11521 ; H01L21/266 ; H01L29/66 ; H01L21/28 ; H01L29/423

Abstract:
A flash memory structure, a memory array and a fabrication method thereof are disclosed. In the flash memory structure, an erase gate structure is formed between two floating gates, and a word line structure is formed on an outer side of each of the two floating gates, with an oxide layer formed between the word line structure and the substrate. The flash memory structure can be fabricated with a simple process. The memory array employing the flash memory structure is capable of erase operations by means of a voltage applied on erase gate lines and of read operations by means of a voltage applied on word lines. This enables read operations at a lower voltage with less power consumed by the memory array. In addition, the memory array is more efficient and more durable.
Public/Granted literature
- US20180301562A1 FLASH MEMORY STRUCTURE, MEMORY ARRAY AND FABRICATION METHOD THEREOF Public/Granted day:2018-10-18
Information query
IPC分类: