Invention Grant
- Patent Title: Patterned substrate and light emitting diode wafer
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Application No.: US15936460Application Date: 2018-03-27
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Publication No.: US10411159B2Publication Date: 2019-09-10
- Inventor: Yen-Lin Lai , Shen-Jie Wang , Jyun-De Wu , Chien-Chih Yen
- Applicant: PlayNitride Inc.
- Applicant Address: TW Hsinchu County
- Assignee: PlayNitride Inc.
- Current Assignee: PlayNitride Inc.
- Current Assignee Address: TW Hsinchu County
- Agency: JCIPRNET
- Priority: TW106110087A 20170327
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/20 ; H01L33/12 ; H01L21/78 ; H01L23/00 ; H01L23/544
Abstract:
A patterned substrate includes a main base and a plurality of patterned structures. The main base has at least one device-disposed region and a cutting region surrounding the device-disposed region. The patterned structures are integratedly formed with the main base, and only distributed in the cutting region of the main base. The patterned structures are separated from each other.
Public/Granted literature
- US20180277718A1 PATTERNED SUBSTRATE AND LIGHT EMITTING DIODE WAFER Public/Granted day:2018-09-27
Information query
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