Invention Grant
- Patent Title: Light emitting diode and fabrication method thereof
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Application No.: US16101198Application Date: 2018-08-10
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Publication No.: US10411163B2Publication Date: 2019-09-10
- Inventor: Cheng Meng , Yuehua Jia , Jing Wang , Chun-Yi Wu , Ching-Shan Tao , Duxiang Wang
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201510097522 20150305; CN201711476546 20171229; CN201721898534U 20171229; CN201721898549U 20171229
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/40 ; H01L33/44 ; H01L33/42 ; H01L33/00 ; H01L33/30

Abstract:
A light-emitting diode includes a light-emitting epitaxial laminated layer and an omnidirectional reflector structure. The light-emitting epitaxial laminated layer has a first surface and an opposing second surface, including an n-type semi-conductive layer, a light emitting layer and a p-type semiconductor layer. The omnidirectional reflector structure is formed on the second surface of the light-emitting epitaxial laminated layer, including: a transparent dielectric layer on the second surface of the light-emitting epitaxial laminated layer and having conductive holes therein; a first transparent adhesive layer on one side surface of the transparent dielectric layer distal from the light-emitting epitaxial laminated layer and covering side walls of the conductive holes; a second transparent adhesive layer on one side surface of the first transparent adhesive layer distal from the transparent dielectric layer; and a metal reflective layer on one side of the second transparent adhesive layer distal from the first transparent adhesive layer.
Public/Granted literature
- US20180351045A1 Light Emitting Diode and Fabrication Method Thereof Public/Granted day:2018-12-06
Information query
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