- Patent Title: Invisible-light light emitting diode and fabrication method thereof
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Application No.: US15870729Application Date: 2018-01-12
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Publication No.: US10411165B2Publication Date: 2019-09-10
- Inventor: Chaoyu Wu , Chun-Yi Wu , Chun Kai Huang , Duxiang Wang
- Applicant: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Current Assignee: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201610381153 20160601
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/44 ; H01L33/04 ; H01L33/30

Abstract:
An invisible-light light-emitting diode includes an N-type ohmic contact semiconductor layer, an N-type current spreading layer, an N—GaAs visible-light absorption layer, an N-type cladding layer, a light-emitting layer, a P-type cladding layer and a P-type ohmic contact semiconductor layer. In the invisible-light light-emitting diode, the absorption layer is GaAs, which can effectively remove all visible light when current density is >1 A/mm2, and essentially all visible light when current density is below 3 A/mm2. This effectively solves the red dot effect of invisible-light light-emitting diodes.
Public/Granted literature
- US20180138371A1 Invisible-light Light Emitting Diode and Fabrication Method Thereof Public/Granted day:2018-05-17
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