Invention Grant
- Patent Title: Multi-layer cable splice
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Application No.: US15459483Application Date: 2017-03-15
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Publication No.: US10411369B2Publication Date: 2019-09-10
- Inventor: Seydou Diop , Paul Zelazny , Dirk Byerman
- Applicant: Hubbell Incorporated
- Applicant Address: US CT Shelton
- Assignee: Hubbell Incorporated
- Current Assignee: Hubbell Incorporated
- Current Assignee Address: US CT Shelton
- Agency: Michael Best & Friedrich, LLP
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H01R4/70 ; H01R4/48 ; H01R43/05 ; H01R4/50 ; H02G7/04 ; H02G7/05 ; H02G15/10

Abstract:
A cable splice includes a casing having a central portion and a first end including a first aperture. The casing defines an interior cavity. A guide assembly extends through the first opening into the interior cavity. A first clamp member is positioned in the interior cavity and moveable between a loading position and a terminated position. A first biasing member biases the first clamp member toward the terminated position. A carrier is positioned in the interior cavity between the first biasing member and the central region. A second clamp member is positioned in the carrier and moveable with respect to the carrier.
Public/Granted literature
- US20170271789A1 MULTI-LAYER CABLE SPLICE Public/Granted day:2017-09-21
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