Invention Grant
- Patent Title: Method for molding electrical connector
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Application No.: US15679454Application Date: 2017-08-17
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Publication No.: US10411375B2Publication Date: 2019-09-10
- Inventor: Ted Ju , Wen Wei Lin , Li Ming Zhang
- Applicant: LOTES CO., LTD
- Applicant Address: TW Keelung
- Assignee: LOTES CO., LTD
- Current Assignee: LOTES CO., LTD
- Current Assignee Address: TW Keelung
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H01R24/78 ; H01R12/00 ; H01R24/00 ; H01R12/70 ; H01R13/6594 ; H01R13/6585 ; H01R24/60 ; B29C63/00 ; H01R43/18 ; H01R13/6477 ; H01R107/00

Abstract:
An electrical connector, including an insulating body; multiple first terminals, insert molded into the insulating body and having at least one grounding terminal, at least one power supply terminal and a pair of differential signal terminals located between the grounding terminal and the power supply terminal adjacent to each other; and a middle shielding sheet, insert molded into the insulating body, and located above or below the first terminals. The middle shielding sheet has, on at least one side of a central line of the middle shielding sheet, a notch and a first protruding portion away from the central line as compared to the notch. The central line extends in a front-rear direction. The notch is concavely provided backward from a front end edge of the middle shielding sheet, and vertically corresponds to the power supply terminal. The first protruding portion has a through-hole vertically corresponding to the grounding terminal.
Public/Granted literature
- US20170346206A1 METHOD FOR MOLDING ELECTRICAL CONNECTOR Public/Granted day:2017-11-30
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