Invention Grant
- Patent Title: Production method for conductive member, conductive member, and mold
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Application No.: US16230221Application Date: 2018-12-21
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Publication No.: US10411429B2Publication Date: 2019-09-10
- Inventor: Osamu Satou , Jiguo Zheng , Masamichi Yamagiwa
- Applicant: SUMITOMO WIRING SYSTEMS, LTD.
- Applicant Address: JP Mie
- Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee: SUMITOMO WIRING SYSTEMS, LTD.
- Current Assignee Address: JP Mie
- Agency: Greenblum & Bernstein, P.L.C.
- Main IPC: H01R43/28
- IPC: H01R43/28 ; H01R4/02 ; H01R43/02 ; H01B5/12 ; H01R4/18 ; H01R4/60 ; H01R11/12

Abstract:
A conductive member production method is performed with use of a die that includes a first die and a second die. The first die includes a protruding portion having a recession-shaped depression formed in a leading end surface, the depression including a molding surface that is inclined so as to gradually extend toward the leading end surface side while extending laterally from the depression. The second die includes a recessed portion into which the protruding portion can be inserted. The method includes a heating step of heating a weld portion formation region that is a portion, with respect to an extending direction, of a conductive member constituted by multiple metal strands, and a pressing step in which the heated weld portion formation region is sandwiched between and pressed by the protruding portion of the first die and the recessed portion of the second die.
Public/Granted literature
- US20190123503A1 PRODUCTION METHOD FOR CONDUCTIVE MEMBER, CONDUCTIVE MEMBER, AND MOLD Public/Granted day:2019-04-25
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