Invention Grant
- Patent Title: Power conversion apparatus and power semiconductor module
-
Application No.: US15526924Application Date: 2015-12-22
-
Publication No.: US10411589B2Publication Date: 2019-09-10
- Inventor: Yukio Nakashima , Takayoshi Miki
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JPPCT/JP2014/083929 20141222
- International Application: PCT/JP2015/085881 WO 20151222
- International Announcement: WO2016/104533 WO 20160630
- Main IPC: H02M1/34
- IPC: H02M1/34 ; H02M7/00 ; H02M7/217 ; H02M7/537 ; H02P27/06

Abstract:
A power conversion apparatus includes a main capacitor to store therein DC power, and an inverter circuit to convert the DC power stored in the main capacitor to AC power. The main capacitor and a power semiconductor element that constitutes the inverter circuit are connected to each other by a P-side common wire through which a switching current flows. A switching-current shunt component is connected in parallel to the P-side common wire.
Public/Granted literature
- US20170338734A1 POWER CONVERSION APPARATUS AND POWER SEMICONDUCTOR MODULE Public/Granted day:2017-11-23
Information query