Invention Grant
- Patent Title: Elastic wave device
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Application No.: US15617061Application Date: 2017-06-08
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Publication No.: US10411672B2Publication Date: 2019-09-10
- Inventor: Tomohiko Murase
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-126547 20160627
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/64 ; H01L41/187 ; H03H9/05 ; H03H9/145 ; H03H9/25 ; H03H9/10

Abstract:
An elastic wave device includes a piezoelectric substrate, IDT electrodes disposed on the piezoelectric substrate, a first wiring line, an insulating layer covering at least a portion of the first wiring line, a second wiring line at least a portion of which is disposed on the insulating layer to provide a three-dimensional crossing portion, a peripheral support including a cavity surrounding the IDT electrodes, the first and second wiring lines, and the insulating layer, a partition support disposed in the cavity, and a cover disposed on the peripheral support and the partition support to cover the cavity. The second wiring line includes a step portion electrically connecting a portion of the second wiring line located on the piezoelectric substrate and a portion of the second wiring line located on the insulating layer to each other. The partition support covers the step portion.
Public/Granted literature
- US20170373667A1 ELASTIC WAVE DEVICE Public/Granted day:2017-12-28
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