Invention Grant
- Patent Title: Power measurement via bond wire coupling
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Application No.: US15582367Application Date: 2017-04-28
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Publication No.: US10412795B2Publication Date: 2019-09-10
- Inventor: Xiaofei Qiu , Lionel Mongin , Pierre Piel
- Applicant: NXP USA, Inc.
- Applicant Address: US TX Austin
- Assignee: NXP USA, Inc.
- Current Assignee: NXP USA, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: H05B6/64
- IPC: H05B6/64 ; H03H7/38 ; H03F3/213 ; H03F3/195 ; H01L23/66 ; H05B6/68 ; G01R21/12 ; H01L23/00 ; H01P5/18 ; H03F1/56

Abstract:
A device includes an output circuit that includes an input port at which a signal is received, an output port at which an impedance-adjusted representation of the signal is provided, and a set of bond wires connecting the input and output ports. The device further includes first and second couplers, each including a respective coupling bond wire along the set of bond wires for inductive coupling with the set of bond wires. The first coupler is oriented relative to the distributed-element output circuit to measure forward power provided by the impedance-adjusted representation of the signal via the output port. The second coupler is oriented relative to the output circuit to measure reflected power received via the output port.
Public/Granted literature
- US20180317288A1 POWER MEASUREMENT VIA BOND WIRE COUPLING Public/Granted day:2018-11-01
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