Invention Grant
- Patent Title: Circuit components and methods for manufacturing the same and bonding devices
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Application No.: US15713362Application Date: 2017-09-22
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Publication No.: US10412823B2Publication Date: 2019-09-10
- Inventor: Tingliang Liu , Shuo Jin , Yuanjie Xu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , Chengdu BOE Optoelectronics Technology Co., Ltd.
- Applicant Address: CN Beijing CN Chengdu, Sichuan Province
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Chengdu, Sichuan Province
- Agency: Kinney & Lange, P.A.
- Priority: CN201710087428 20170217
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/16 ; H05K1/18 ; H05K3/30 ; H05K3/32 ; H05K1/14 ; H05K3/36
Abstract:
The present disclosure discloses a circuit component and a method for manufacturing the same and a bonding device. The circuit component comprises a first circuit board and a second circuit board, wherein at least one of the first circuit board and the second circuit board comprises a bonding detection layer configured to be capable of detecting a bonding parameter between the first circuit board and the second circuit board; and emitting a detection signal when the bonding parameter reaches a preset value.
Public/Granted literature
- US20180242445A1 CIRCUIT COMPONENTS AND METHODS FOR MANUFACTURING THE SAME AND BONDING DEVICES Public/Granted day:2018-08-23
Information query
