Invention Grant
- Patent Title: Configuration element for printed circuit board assemblies
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Application No.: US16102356Application Date: 2018-08-13
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Publication No.: US10412825B2Publication Date: 2019-09-10
- Inventor: David Michael Davis , Gary Edward Webb
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Kagan Binder, PLLC
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H05K1/02 ; H05K3/34 ; H05K1/18

Abstract:
A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.
Public/Granted literature
- US20180352647A1 CONFIGURATION ELEMENT FOR PRINTED CIRCUIT BOARD ASSEMBLIES Public/Granted day:2018-12-06
Information query
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