Invention Grant
- Patent Title: Component mounting device and component mounting method
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Application No.: US15026525Application Date: 2013-10-01
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Publication No.: US10412869B2Publication Date: 2019-09-10
- Inventor: Ryohei Kamio
- Applicant: FUJI CORPORATION
- Applicant Address: JP Chiryu-shi
- Assignee: FUJI CORPORATION
- Current Assignee: FUJI CORPORATION
- Current Assignee Address: JP Chiryu-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2013/076712 WO 20131001
- International Announcement: WO2015/049721 WO 20150409
- Main IPC: H05K13/08
- IPC: H05K13/08 ; H05K13/04

Abstract:
A component mounting device performs measurement of a position of a reference section of a head and measurement of calibration data of the head, and the calibration data of the head and the position of the reference section are stored in association. The component mounting device controls operation of the head holding body in which the head is held based on the calibration data of the head and the position of the reference section. In a case where it is not necessary to generate the calibration data of the predetermined head, the component mounting device measures the position of the reference section, and controls operation of the head holding body in which the head is held based on the measured position of the reference section, the position of the reference section which is stored, and the calibration data of the head.
Public/Granted literature
- US20160227684A1 COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD Public/Granted day:2016-08-04
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