Invention Grant
- Patent Title: Chiller apparatus for plasma treatment device
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Application No.: US15314203Application Date: 2016-06-09
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Publication No.: US10415862B2Publication Date: 2019-09-17
- Inventor: Atsushi Seki , Seiichiro Sakai
- Applicant: SHINWA CONTROLS CO., LTD.
- Applicant Address: JP Kawasaki-shi
- Assignee: SHINWA CONTROLS CO., LTD
- Current Assignee: SHINWA CONTROLS CO., LTD
- Current Assignee Address: JP Kawasaki-shi
- Agency: Oliff PLC
- Priority: JP2015-120572 20150615
- International Application: PCT/JP2016/067293 WO 20160609
- International Announcement: WO2016/204076 WO 20161222
- Main IPC: C23C14/54
- IPC: C23C14/54 ; C23C16/44 ; C23C16/46 ; F25B1/00 ; H01L21/3065 ; C23C14/24 ; F25B39/00 ; H01J37/32 ; H01L21/67 ; F25B49/02 ; F25B39/02

Abstract:
In the present chiller apparatus, a refrigerant flow path is branchably attached to a lower electrode serving as a large sample table, which copes with a case where the surface area of a sample is large in a configuration in which a plasma treatment device connected to a refrigerant cycle equipped with a heating device is applied. A control device transmits a heating adjustment control signal generated based on a result of a PID arithmetic operation including proportion, integration, and differentiation on a lower electrode refrigerant pipe refrigerant detection temperature detected from a temperature sensor provided in the vicinity of a refrigerant flow path of a heat insulating portion relative to the lower electrode of a lower electrode refrigerant pipe connected to be linked to the refrigerant cycle to a heating device and performs feedback control such that the lower electrode refrigerant pipe refrigerant detection temperature becomes a setting temperature.
Public/Granted literature
- US20180038620A1 CHILLER APPARATUS FOR PLASMA TREATMENT DEVICE Public/Granted day:2018-02-08
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