Invention Grant
- Patent Title: Heterogeneous network in a modular chassis
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Application No.: US16166443Application Date: 2018-10-22
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Publication No.: US10416752B2Publication Date: 2019-09-17
- Inventor: Frank Szu-Jen Yang , Jason Luo Pang , Eliot Michael Dresselhaus , Dino Farinacci , Andreas Demetrios Bovopoulos , Mark Tehmin Yin
- Applicant: Platina Systems Corp.
- Applicant Address: US CA Santa Clara
- Assignee: Platina Systems Corporation
- Current Assignee: Platina Systems Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Baker Botts L.L.P.
- Main IPC: G06F1/3287
- IPC: G06F1/3287 ; G06F1/18 ; G06F13/36 ; G06F13/40 ; H04L12/46 ; H04L12/723 ; H04L29/06 ; G06F1/20 ; G06F1/30 ; G06F1/3296

Abstract:
In one embodiment, a system includes a number of application-specific integrated circuits (ASICs). The system also includes one or more processors coupled to the ASICs including instructions executable by the processors. The processors being operable when executing the instructions to configure the plurality of ASICs to route data packets using a standard protocol; configure the ASICs to set up a tunnel, using the standard protocol, for moving data packets from one ASIC to another of the number of ASICs; and implement a software overlay to facilitate interaction between the number of ASICs through the tunnel for moving the data packets.
Public/Granted literature
- US20190056776A1 Heterogeneous Network in a Modular Chassis Public/Granted day:2019-02-21
Information query
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