Invention Grant
- Patent Title: Semiconductor memory device
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Application No.: US16014486Application Date: 2018-06-21
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Publication No.: US10418080B2Publication Date: 2019-09-17
- Inventor: Hyun-Jin Shin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2017-0137566 20171023
- Main IPC: G11C7/12
- IPC: G11C7/12 ; G11C16/24 ; G11C16/04 ; G11C7/04 ; G11C16/26 ; G11C7/06 ; G11C7/08 ; G11C5/14 ; G11C16/30 ; G11C16/34

Abstract:
A semiconductor memory device includes a memory cell array including a plurality of memory cells connected to a plurality of bit lines, a control signal generating circuit configured to generate a first control signal in response to a first operating temperature of the semiconductor memory device and a second control signal in response to a second operating temperature of the semiconductor memory device, a precharge circuit configured to provide a precharge current to a first bit line of the plurality of bit lines in response to an enable signal, and a boost circuit configured to provide a boost current to the first bit line in response to the enable signal, wherein the magnitude of the boost circuit is responsive to one of the first and second control signals.
Public/Granted literature
- US20190122710A1 SEMICONDUCTOR MEMORY DEVICE Public/Granted day:2019-04-25
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