Invention Grant
- Patent Title: None-coupling dual inductor
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Application No.: US15625922Application Date: 2017-06-16
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Publication No.: US10418166B2Publication Date: 2019-09-17
- Inventor: Martin Kuo , Nanhai Zhu
- Applicant: ITG ELECTRONICS, INC.
- Applicant Address: TW New Taipei
- Assignee: ITG ELECTRONICS, INC.
- Current Assignee: ITG ELECTRONICS, INC.
- Current Assignee Address: TW New Taipei
- Agency: Intellectual Property Law Group LLP
- Main IPC: H01F27/24
- IPC: H01F27/24 ; H01F27/28 ; H01F1/34 ; H01F3/10 ; H01F27/38 ; H01F27/29

Abstract:
A none-coupling dual inductor is provided, including a main iron core body having a middle bump, a plurality of subsidiary iron core bodies respectively disposed corresponding to two sides of the main iron core body, a plurality of metal sheet coils respectively disposed between the two sides of the main iron core body and the plurality of subsidiary iron core bodies, and a plurality of plate bodies respectively disposed between the main iron core body and the plurality of metal sheet coils and the plurality of subsidiary iron core bodies. The none-coupling dual inductor shares the middle bump of the main iron core body to be integrally formed so as to save space and increase power density. Even if the magnetic circuits of two inductors have a significant difference in the magnetic resistance, the none-coupling dual inductor of the present disclosure can still have a low coupling coefficient.
Public/Granted literature
- US20180366256A1 NONE-COUPLING DUAL INDUCTOR Public/Granted day:2018-12-20
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