The present disclosure relates to a method for bonding semiconductor components. A semiconductor component comprising microbumps on a planar bonding surface is prepared for bonding by applying a photosensitive polymer layer on the bonding surface. The average thickness of the initial polymer layer in between the microbumps is similar to the average height of the microbumps. In a lithography process, the polymer is removed from the upper surface of the microbumps and from areas around the microbumps. The polymer is heated to a temperature at which the polymer flows, resulting in a polymer layer that closely adjoins the microbumps, without exceeding the microbump height. The closely adjoining polymer layer may have a degree of planarity substantially similar to a planarized layer.