Invention Grant
- Patent Title: Electronic packages with three-dimensional conductive planes, and methods for fabrication
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Application No.: US15881238Application Date: 2018-01-26
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Publication No.: US10418344B2Publication Date: 2019-09-17
- Inventor: Erik Paul Vick , Dorota Temple
- Applicant: Micross Advanced Interconnect Technology LLC
- Applicant Address: US NC Research Triangle Park
- Assignee: Micross Advanced Interconnect Technology LLC
- Current Assignee: Micross Advanced Interconnect Technology LLC
- Current Assignee Address: US NC Research Triangle Park
- Agency: Olive Law Group, PLLC
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L25/00 ; H01L23/48 ; H01L23/498
Abstract:
An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.
Public/Granted literature
- US20180151542A1 ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND METHODS FOR FABRICATION Public/Granted day:2018-05-31
Information query
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