Invention Grant
- Patent Title: Light emitting diode package and light emitting diode module
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Application No.: US15708792Application Date: 2017-09-19
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Publication No.: US10418348B2Publication Date: 2019-09-17
- Inventor: Myung Jin Kim , Kwang Yong Oh , Seung Ryeol Ryu
- Applicant: Seoul Semiconductor Co., Ltd.
- Applicant Address: KR Ansan-si
- Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee: Seoul Semiconductor Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2016-0120765 20160921
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L25/13 ; H01L33/50 ; H01L33/48

Abstract:
A light emitting diode package including a housing, a first light emitting diode chip and a second light emitting diode chip disposed in the housing, and a wavelength conversion part including a phosphor configured to absorb light emitted from the first light emitting diode chip and emit light having a different wavelength than the light emitted from the first light emitting diode chip, in which the light emitted from the first light emitting diode chip has a shorter wavelength than light emitted from the second light emitting diode chip, and the phosphor has a fluorescence intensity of 10 or less at a peak wavelength of light emitted from the second light emitting diode chip, with reference to a maximum fluorescence intensity of 100 at a wavelength of 425 nm to 475 nm on an excitation spectrum of the second light emitting diode chip.
Public/Granted literature
- US20180082985A1 LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING DIODE MODULE Public/Granted day:2018-03-22
Information query
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