Invention Grant
- Patent Title: Semiconductor device having IGBT portion and diode portion
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Application No.: US15912600Application Date: 2018-03-06
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Publication No.: US10418470B2Publication Date: 2019-09-17
- Inventor: Ryohei Gejo , Kazutoshi Nakamura , Norio Yasuhara , Tomohiro Tamaki
- Applicant: Kabushiki Kaisha Toshiba , Toshiba Electronic Devices & Storage Corporation
- Applicant Address: JP Minato-ku JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Minato-ku JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-176263 20170914
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/739 ; H01L29/08 ; H01L29/861 ; H01L27/07 ; H01L29/423 ; H01L29/06

Abstract:
A semiconductor device according to an embodiment includes a first diode portion including a first trench extending in a first direction, and a first trench electrode; a second diode portion adjacent to the first diode portion in the first direction and includes a second trench extending in the first direction, and a second trench electrode and of which the width in the first direction is greater than the width of the first diode portion in a second direction perpendicular to the first direction; and a first IGBT portion adjacent to the first diode portion in the second direction and is adjacent to the second diode portion in the first direction and includes a third trench extending in the first direction, and a first gate electrode.
Public/Granted literature
- US20190081162A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-03-14
Information query
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