Invention Grant
- Patent Title: Thermoelectric material and thermoelectric module
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Application No.: US15440511Application Date: 2017-02-23
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Publication No.: US10418538B2Publication Date: 2019-09-17
- Inventor: Masakazu Mukaida , Qingshuo Wei , Takao Ishida , Yasuhisa Naitoh
- Applicant: National Institute of Advanced Industrial Science and Technology
- Applicant Address: JP Tokyo
- Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee: National Institute of Advanced Industrial Science and Technology
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Main IPC: H01L35/34
- IPC: H01L35/34 ; H01L35/24 ; H01L35/02
Abstract:
A thermoelectric material is manufactured by a manufacturing process including annealing at an annealing temperature from 125° C. to 200° C. and for an annealing time from 5 minutes to 12 hours applied to a substance selected from the group consisting of conductive polymer, polystyrene sulfonate (PSS), tosylate (TOS), chloride and perchlorate and a substance as solvent selected from the group consisting of ethylene glycol, ethanol, dimethyl sulfoxide and isopropanol.
Public/Granted literature
- US20170162777A1 THERMOELECTRIC MATERIAL AND THERMOELECTRIC MODULE Public/Granted day:2017-06-08
Information query
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