Invention Grant
- Patent Title: Microspeaker enclosure with porous materials in resonance space
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Application No.: US15615155Application Date: 2017-06-06
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Publication No.: US10419847B2Publication Date: 2019-09-17
- Inventor: Kyu Dong Choi , Jong Heon Ha , Hyeon Taek Oh
- Applicant: EM-TECH. Co., Ltd.
- Applicant Address: KR Busan
- Assignee: EM-TECH. Co., Ltd.
- Current Assignee: EM-TECH. Co., Ltd.
- Current Assignee Address: KR Busan
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: KR10-2016-0070269 20160607
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/28 ; H04R1/02

Abstract:
The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.
Public/Granted literature
- US20170353785A1 Microspeaker Enclosure with Porous Materials in Resonance Space Public/Granted day:2017-12-07
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