This electronic device includes a metallic casing that accommodates a component and a circuit board in respective spaces separated by a partition wall, and a metallic cover for protecting the circuit board by covering the casing. The cover has a protruding portion protruding toward the accommodating space for accommodating the circuit board, and the casing has a receiving portion to which the protruding portion is fitted at a position corresponding to the protruding portion. The cover has a deformation suppressing portion formed so that a bending rigidity with respect to a bending which is bent with a forming position of the protruding portion as a fulcrum and is directed to a protruding direction of the protruding portion as a fulcrum is greater than a bending rigidity in planar structure in a facing surface opposed to the circuit board.