An electronic control device includes a heating element, a circuit substrate, a heat radiation plate, and a heat radiation material. Connection terminals of the heating element are fixed to wiring patterns on a circuit principal surface of the circuit substrate with solder. Through holes are provided in the circuit substrate at portions spaced away from the distal ends of the connection terminals of the heating element by a distance equal to or smaller than a thickness of the circuit substrate. The heat radiation material applied between a circuit principal surface of the circuit substrate and the heat radiation plate is exposed to the circuit principal surface via the through holes. The heat radiation material exposed to the circuit principal surface covers the distal ends of the connection terminals fixed with the solder.