A sensing module apparatus is provided for monitoring a vibrating machine or structure, such as a pump, which include three mounting points on the apparatus for securely mounting the apparatus to the vibrating machine or structure. The three-point mount configuration provides the sensor module with a very rigid mount connection to virtually any surface condition, including flat, curved or irregular. All six degrees of freedom (X, Y, Z, theta-X, theta-Y and theta-Z) are properly constrained. The three-point mount also provides an air barrier or gap between the sensing module and the equipment surface, allowing the sensor to be mounted to higher surface temperature devices.