Invention Grant
- Patent Title: Pattern forming method and pattern structural body
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Application No.: US15267684Application Date: 2016-09-16
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Publication No.: US10423065B2Publication Date: 2019-09-24
- Inventor: Masahiko Akiyama
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2015-243813 20151215
- Main IPC: G03F7/00
- IPC: G03F7/00 ; H01L51/00 ; H01L51/05

Abstract:
According to one embodiment, a pattern forming method is disclosed. The method includes preparing a processed body including a substrate having a first face, a first layer provided on the first face, a second layer provided on the first layer, and a photosensitive lyophilic/lyophobic original material provided on the second layer. The method includes performing a first process of irradiating light onto one of a first portion at a first position of the material and a second portion at a second position of the material, and making a first contact angle of a liquid with a first region of an upper face of the processed body relatively larger than a second contact angle of the liquid with a second region of the upper face. The method includes performing a first pattern forming process of forming a first pattern by bringing the liquid into contact with the second region.
Public/Granted literature
- US20170168388A1 PATTERN FORMING METHOD AND PATTERN STRUCTURAL BODY Public/Granted day:2017-06-15
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