Invention Grant
- Patent Title: System, method and computer-accessible medium for providing secure split manufacturing
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Application No.: US14775164Application Date: 2014-03-14
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Publication No.: US10423749B2Publication Date: 2019-09-24
- Inventor: Jeyavijayan Rajendran , Ozgur Sinanoglu , Ramesh Karri
- Applicant: New York University
- Applicant Address: US NY New York
- Assignee: New York University
- Current Assignee: New York University
- Current Assignee Address: US NY New York
- Agency: Hunton Andrews Kurth LLP
- International Application: PCT/US2014/028757 WO 20140314
- International Announcement: WO2014/153029 WO 20140925
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F21/75

Abstract:
Exemplary systems, methods and computer-accessible mediums can secure split manufacturing of an integrated circuit by modifying a previous location of at least one pin to a further location of the at least one pin based on a fault analysis procedure. A determination of the further location can include an iterative procedure that can be a greedy iterative procedure. The modification of the location of the at least one partition pin can be performed by swapping at least one further partition pin with the at least one partition pin.
Public/Granted literature
- US20160034628A1 SYSTEM, METHOD AND COMPUTER-ACCESSIBLE MEDIUM FOR PROVIDING SECURE SPLIT MANUFACTURING Public/Granted day:2016-02-04
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