Invention Grant
- Patent Title: Manufacturing process of elemental chip
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Application No.: US15682814Application Date: 2017-08-22
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Publication No.: US10424486B2Publication Date: 2019-09-24
- Inventor: Noriyuki Matsubara
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2016-187024 20160926
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; H01L21/311 ; G03F7/09 ; H01L21/308 ; H01L21/78 ; H01L21/027 ; H01L21/32 ; H01L21/3213 ; G03F7/039 ; H01L21/683

Abstract:
A manufacturing process of an elemental chip comprises steps of preparing a substrate held on the holding tape, the substrate including first and second sides opposite each other and the second side thereof being held on the holding tape, and the substrate further including a plurality of element regions and a plurality of segmentation regions defining each of the element regions; spraying a resist solution to form droplets of the resist solution, the resist solution containing a resist constituent and a solvent; forming a resist layer by vaporizing the solvent from the droplets and depositing the resist constituent on the first side of the substrate that is held on the holding tape; patterning the resist layer to expose the first side of the substrate in the segmentation regions; and plasma-etching the first side of the substrate exposed in the segmentation regions thereof.
Public/Granted literature
- US20180090333A1 MANUFACTURING PROCESS OF ELEMENTAL CHIP Public/Granted day:2018-03-29
Information query
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