A method of manufacturing an electronic device includes: in transferring one or a plurality of element sections onto a first substrate from a second substrate, forming part or all of the one or the plurality of element sections on the second substrate with a resin layer in between; peeling off the one or the plurality of element sections that are formed on the second substrate from the second substrate through laser irradiation performed on the resin layer, and disposing, onto the first substrate, the one or the plurality of element sections peeled off; and using, as the resin layer, resin having glass-transition temperature and thermal decomposition temperature that differ from each other by 150 degrees centigrade or less.