Invention Grant
- Patent Title: Solder fill into high aspect through holes
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Application No.: US15670315Application Date: 2017-08-07
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Publication No.: US10424510B2Publication Date: 2019-09-24
- Inventor: Toyohiro Aoki , Akihiro Horibe , Kuniaki Sueoka , Kazushige Toriyama
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/67 ; H01L21/687 ; B23K3/06 ; H01L21/48
Abstract:
A method for filling a through hole with solder includes mounting a substrate having a through hole formed therein on a permeable barrier layer having pores that enable gas to flow through the permeable barrier. A solder source is positioned over the through hole. Molten solder is delivered in the through hole with a positive pressure from the solder source such that gas in the through holes passes the permeable barrier while the molten solder remains in the through hole.
Public/Granted literature
- US20170338152A1 SOLDER FILL INTO HIGH ASPECT THROUGH HOLES Public/Granted day:2017-11-23
Information query
IPC分类:
