Invention Grant
- Patent Title: Method of processing workpiece
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Application No.: US15938755Application Date: 2018-03-28
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Publication No.: US10424511B2Publication Date: 2019-09-24
- Inventor: Kenji Takenouchi
- Applicant: DISCO CORPORATION
- Applicant Address: JP Tokyo
- Assignee: DISCO CORPORATION
- Current Assignee: DISCO CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greer Burns & Crain, Ltd.
- Priority: JP2017-074465 20170404
- Main IPC: H01L21/78
- IPC: H01L21/78 ; B23K26/38 ; B26D3/06 ; B23K26/40 ; B23K26/364 ; H01L21/66 ; B23K103/00

Abstract:
A method of processing a plate-shaped workpiece that includes on a face side thereof layered bodies containing metal which are formed in superposed relation to projected dicing lines includes the steps of holding a face side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a reverse side thereof along the projected dicing lines to form laser-processed grooves in the workpiece which terminate short of the layered bodies, and thereafter, cutting bottoms of the laser-processed grooves with a cutting blade to sever the workpiece together with the layered bodies along the projected dicing lines. The step of cutting bottoms of the laser-processed grooves includes the step of cutting bottoms of the laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.
Public/Granted literature
- US20180286755A1 METHOD OF PROCESSING WORKPIECE Public/Granted day:2018-10-04
Information query
IPC分类: