An anisotropic conductive film that is capable of suppressing the occurrence of short circuit during anisotropic conductive connection of electrical components having decreased pitch, and suppressing a decrease in conduction reliability during storage under a high temperature and high humidity environment has a structure in which a conductive particle-containing layer containing conductive particles that are arranged in a single layer in a layered binder resin composition is layered on at least a first insulating resin composition layer. The lowest melt viscosity of the binder resin composition is equal to or higher than that of a first insulating resin composition. A second insulating resin composition layer is further layered on a surface of the conductive particle-containing layer on a side opposite to the first insulating resin composition layer. The lowest melt viscosity of the binder resin composition is higher than those of the first and second insulating resin compositions.