A component carrier including an electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The electronic component directly contacts the component contacting end. The wiring contacting end is directly electrically contacted to the wiring structure. The exterior surface portion of the coupling structure has homogeneous ablation properties and surface recesses filled with an electrically conductive wiring structure. A method includes embedding an electronic component in an electrically insulating core, providing a coupling structure with a conductive connection having a component end and a wiring end, connecting the electronic component directly to the component end, providing a surface portion of the coupling structure with homogeneous ablation properties, patterning the surface portion with recesses and filling the recesses with a wiring structure such that the wiring end is contacted directly.