Invention Grant
- Patent Title: Mounting component, semiconductor device using same, and manufacturing method thereof
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Application No.: US16018829Application Date: 2018-06-26
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Publication No.: US10424555B2Publication Date: 2019-09-24
- Inventor: Masatoshi Nakagaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Global IP Counselors, LLP
- Priority: JP2017-127296 20170629
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/00 ; H01L23/538 ; H01S5/02 ; H01L21/52 ; H01L23/544 ; H01S5/022 ; H01L23/373 ; H01S5/024
Abstract:
A mounting component includes a main body and a metal layer. The main body has a first main surface and a second main surface. The metal layer is arranged on the first main surface of the main body. The metal layer includes at least one concave recognition mark having an inclined surface that is inclined with respect to a main surface of the metal layer.
Public/Granted literature
- US20190006310A1 MOUNTING COMPONENT, SEMICONDUCTOR DEVICE USING SAME, AND MANUFACTURING METHOD THEREOF Public/Granted day:2019-01-03
Information query
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